Advanced MEMS Packaging - John Lau - Books - McGraw-Hill Education - Europe - 9780071626231 - December 16, 2009
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Advanced MEMS Packaging Ed edition


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This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging.


576 pages, Illustrations

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 16, 2009
ISBN13 9780071626231
Publishers McGraw-Hill Education - Europe
Pages 576
Dimensions 161 × 237 × 36 mm   ·   906 g

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