3D IC Integration and Packaging - John Lau - Books - McGraw-Hill Education - Europe - 9780071848060 - October 16, 2015
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3D IC Integration and Packaging Ed edition

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A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications


512 pages

Media Books     Hardcover Book   (Book with hard spine and cover)
Released October 16, 2015
ISBN13 9780071848060
Publishers McGraw-Hill Education - Europe
Pages 480
Dimensions 196 × 245 × 28 mm   ·   1.03 kg
Language English  

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