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3D IC Integration and Packaging John Lau Ed edition
3D IC Integration and Packaging
John Lau
A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications
512 pages
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | October 16, 2015 |
| ISBN13 | 9780071848060 |
| Publishers | McGraw-Hill Education - Europe |
| Pages | 480 |
| Dimensions | 196 × 245 × 28 mm · 1.03 kg |
| Language | English |
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