Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration - John Lau - Books - Springer Verlag, Singapore - 9789819568901 - June 1, 2026
In case cover and title do not match, the title is correct

John Lau
Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

Price
HK$ 1,573
excl. VAT

Ordered from remote warehouse

Expected to be ready for shipping Jul 30 - Aug 5
Get notified about new John Lau releases

Our customers say:

14-day return policy in accordance with European consumer protection law
Top ranking on Trustpilot
Add to your iMusic wish list

Not rated yet

This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more emphasis placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as Cu interconnects, glass-core substrate, 3D heterogeneous integration of photonic IC and electronic IC, and combining simulation design with AI technology to effectively apply it to semiconductor packaging.

This book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Media Books     Hardcover Book   (Book with hard spine and cover)
Released June 1, 2026
ISBN13 9789819568901
Publishers Springer Verlag, Singapore
Pages 547
Dimensions 150 × 220 × 20 mm   ·   970 g

More by John Lau

Show all

More from the same publisher

See all of John Lau ( e.g. Hardcover Book and Paperback Book )