Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces - Springer Theses - Qingke Zhang - Books - Springer-Verlag Berlin and Heidelberg Gm - 9783662517253 - August 23, 2016
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Qingke Zhang
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces - Springer Theses Softcover reprint of the original 1st ed. 2016 edition

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This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions.

143 pages, 81 Illustrations, color; 34 Illustrations, black and white; XV, 143 p. 115 illus., 81 ill

Media Books     Paperback Book   (Book with soft cover and glued back)
Released August 23, 2016
ISBN13 9783662517253
Publishers Springer-Verlag Berlin and Heidelberg Gm
Pages 143
Dimensions 150 × 220 × 10 mm   ·   231 g
Language German  

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