Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces - Springer Theses - Qingke Zhang - Books - Springer-Verlag Berlin and Heidelberg Gm - 9783662488218 - November 16, 2015
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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces - Springer Theses 1st ed. 2016 edition


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This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions.


143 pages, 81 black & white illustrations, 34 colour illustrations, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released November 16, 2015
ISBN13 9783662488218
Publishers Springer-Verlag Berlin and Heidelberg Gm
Pages 143
Dimensions 155 × 235 × 15 mm   ·   442 g
Language German  

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