Die Attach Materials for High Temperature Applications in Microelectronics Packa - - Books - Springer International Publishing AG - 9783319992556 - February 7, 2019
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Die Attach Materials for High Temperature Applications in Microelectronics Packa 1st ed. 2019 edition

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276 pages, 100 Tables, color; 121 Illustrations, color; 54 Illustrations, black and white; XX, 276 p

Media Books     Book
Released February 7, 2019
ISBN13 9783319992556
Publishers Springer International Publishing AG
Pages 279
Dimensions 242 × 167 × 19 mm   ·   623 g
Language German  
Editor Siow, Kim S.

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