Three Dimensional System Integration: IC Stacking Process and Design - Antonis Papanikolaou - Books - Springer-Verlag New York Inc. - 9781489981820 - September 2, 2014
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Antonis Papanikolaou
Three Dimensional System Integration: IC Stacking Process and Design 2011 edition

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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life.

246 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released September 2, 2014
ISBN13 9781489981820
Publishers Springer-Verlag New York Inc.
Pages 246
Dimensions 155 × 235 × 14 mm   ·   394 g
Language English  
Editor Papanikolaou, Antonis
Editor Radojcic, Riko
Editor Soudris, Dimitrios

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