Three Dimensional System Integration: IC Stacking Process and Design - Antonis Papanikolaou - Books - Springer-Verlag New York Inc. - 9781441909619 - December 15, 2010
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Antonis Papanikolaou
Three Dimensional System Integration: IC Stacking Process and Design 2011 edition

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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life.

254 pages, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 15, 2010
ISBN13 9781441909619
Publishers Springer-Verlag New York Inc.
Genre Aspects (Academic) > Science / Technology Aspects
Pages 246
Dimensions 155 × 235 × 15 mm   ·   571 g
Language English  
Editor Papanikolaou, Antonis
Editor Radojcic, Riko
Editor Soudris, Dimitrios

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