Solder Joint Reliability Prediction for Multiple Environments - Andrew E. Perkins - Books - Springer-Verlag New York Inc. - 9781441946348 - November 5, 2010
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Andrew E. Perkins
Solder Joint Reliability Prediction for Multiple Environments Softcover reprint of hardcover 1st ed. 2009 edition

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Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.

192 pages, 70 black & white illustrations, 37 black & white tables, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released November 5, 2010
ISBN13 9781441946348
Publishers Springer-Verlag New York Inc.
Pages 192
Dimensions 155 × 235 × 11 mm   ·   299 g
Language English  

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