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Solder Joint Reliability Prediction for Multiple Environments Andrew E. Perkins 2009 edition
Solder Joint Reliability Prediction for Multiple Environments
Andrew E. Perkins
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.
192 pages, 70 black & white illustrations, 37 black & white tables, biography
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | October 23, 2008 |
| ISBN13 | 9780387793931 |
| Publishers | Springer-Verlag New York Inc. |
| Pages | 192 |
| Dimensions | 155 × 235 × 12 mm · 417 g |
| Language | English |