Solder Joint Reliability Prediction for Multiple Environments - Andrew E. Perkins - Books - Springer-Verlag New York Inc. - 9780387793931 - October 23, 2008
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Solder Joint Reliability Prediction for Multiple Environments 2009 edition

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Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.


192 pages, 70 black & white illustrations, 37 black & white tables, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released October 23, 2008
ISBN13 9780387793931
Publishers Springer-Verlag New York Inc.
Pages 192
Dimensions 155 × 235 × 12 mm   ·   417 g
Language English  

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