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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package - IEEE Press B Keser
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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package - IEEE Press
B Keser
300 pages
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | December 29, 2021 |
| Original release date | 2022 |
| ISBN13 | 9781119793779 |
| Publishers | John Wiley & Sons Inc |
| Pages | 320 |
| Dimensions | 150 × 220 × 20 mm · 589 g |
| Language | English |
| Editor | Keser, Beth |
| Editor | Krohnert, Steffen |
