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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies - IEEE Press B Keser
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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies - IEEE Press
B Keser
576 pages
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | March 29, 2019 |
| ISBN13 | 9781119314134 |
| Publishers | John Wiley & Sons Inc |
| Pages | 576 |
| Dimensions | 235 × 160 × 33 mm · 1.03 kg |
| Language | English |
| Editor | Keser, Beth |
| Editor | Kr¿hnert, Steffen |
