Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems - Juan Cepeda-Rizo - Books - Taylor & Francis Ltd - 9781041216919 - December 24, 2026
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Juan Cepeda-Rizo
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems 2nd edition

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HK$ 1,048
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Expected delivery Jan 4 - 6, 2027
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Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments has cutting-edge information on how to design, analyze, and test in the small satellite environment.

Media Books     Hardcover Book   (Book with hard spine and cover)
To be released December 24, 2026
ISBN13 9781041216919
Publishers Taylor & Francis Ltd
Pages 304
Dimensions 150 × 220 × 20 mm   ·   490 g   (Weight (estimated))

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