Tell your friends about this item:
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems Juan Cepeda-Rizo
Price
HK$ 629
excl. VAT
Ordered from remote warehouse
Expected to be ready for shipping Aug 18 - 28
Get notified about new Juan Cepeda-Rizo releases
Our customers say:
Add to your iMusic wish list
Also available as:
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems
Juan Cepeda-Rizo
This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.
290 pages, 70 Tables, black and white; 188 Line drawings, black and white; 29 Halftones, black and w
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | August 26, 2024 |
| ISBN13 | 9781032160856 |
| Publishers | Taylor & Francis Ltd |
| Pages | 290 |
| Dimensions | 157 × 233 × 21 mm · 470 g |
| Language | English |
