Elements of Electromigration: Electromigration in 3D IC technology - Tu, King-Ning (City University of Hong Kong) - Books - Taylor & Francis Ltd - 9781032470283 - December 25, 2025
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Tu, King-Ning (City University of Hong Kong)
Elements of Electromigration: Electromigration in 3D IC technology

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In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures.

Media Books     Paperback Book   (Book with soft cover and glued back)
Released December 25, 2025
ISBN13 9781032470283
Publishers Taylor & Francis Ltd
Pages 132
Dimensions 150 × 220 × 10 mm   ·   260 g
Language English  

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