Elements of Electromigration: Electromigration in 3D IC technology - Tu, King-Ning (City University of Hong Kong) - Books - Taylor & Francis Ltd - 9781032470276 - January 19, 2024
In case cover and title do not match, the title is correct

Tu, King-Ning (City University of Hong Kong)
Elements of Electromigration: Electromigration in 3D IC technology

Price
HK$ 1,003
excl. VAT

Ordered from remote warehouse

Expected to be ready for shipping Aug 12 - 24
Get notified about new Tu, King-Ning (City University of Hong Kong) releases

Our customers say:

14-day return policy in accordance with European consumer protection law
Top ranking on Trustpilot
Add to your iMusic wish list

Not rated yet

Also available as:

In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures.

184 pages, 5 Tables, black and white; 27 Line drawings, black and white; 38 Halftones, black and whi

Media Books     Hardcover Book   (Book with hard spine and cover)
Released January 19, 2024
ISBN13 9781032470276
Publishers Taylor & Francis Ltd
Pages 132
Dimensions 150 × 220 × 20 mm   ·   640 g
Language English  

More from the same publisher

See all of Tu, King-Ning (City University of Hong Kong) ( e.g. Hardcover Book and Paperback Book )