Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design -  - Books - Taylor & Francis Ltd - 9781032363820 - June 26, 2025
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Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design

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This book deals with various new generation interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis.

Media Books     Paperback Book   (Book with soft cover and glued back)
Released June 26, 2025
ISBN13 9781032363820
Publishers Taylor & Francis Ltd
Pages 212
Dimensions 150 × 220 × 10 mm   ·   360 g
Language English  
Editor Ajayan, J (SR UNIVERSITY, INDIA)
Editor Bhattacharya, Sandip (SR UNIVERSITY, INDIA)
Editor Herrera, Fernando Avila

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