Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design -  - Books - Taylor & Francis Ltd - 9781032363813 - December 22, 2023
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Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design

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This book deals with various new generation interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis.


256 pages, 11 Tables, black and white; 123 Line drawings, black and white; 7 Halftones, black and wh

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 22, 2023
ISBN13 9781032363813
Publishers Taylor & Francis Ltd
Pages 212
Dimensions 150 × 220 × 20 mm   ·   489 g
Language English  
Editor Ajayan, J (SR UNIVERSITY, INDIA)
Editor Bhattacharya, Sandip (SR UNIVERSITY, INDIA)
Editor Herrera, Fernando Avila

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