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2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 1 American Society of Mechanical Engineers
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2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 1
American Society of Mechanical Engineers
This collection of 86 full-length, peer-reviewed technical papers focuses on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS. These proceedings cover the latest research and emerging technologies.
768 pages
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | December 30, 2013 |
| ISBN13 | 9780791855751 |
| Publishers | American Society of Mechanical Engineers |
| Pages | 768 |
| Dimensions | 150 × 220 × 10 mm · 1.15 kg (Weight (estimated)) |
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