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THERMAL MANAGEMENT OF MICROELECTRONIC EQUIPMENT (801683) - ASME Press Series on Electronic Packaging Lian-tuu Yeh
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THERMAL MANAGEMENT OF MICROELECTRONIC EQUIPMENT (801683) - ASME Press Series on Electronic Packaging
Lian-tuu Yeh
With this systematic examination of the factors that govern the thermal performance of electronics, the authors solve design problems encountered in developing and analysing very-high-performance and high-heat-dissipation devices, as well as intermediate and lower-power devices.
440 pages
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | 2002 |
| ISBN13 | 9780791801680 |
| Publishers | American Society of Mechanical Engineers |
| Pages | 440 |
| Dimensions | 241 × 162 × 31 mm · 793 g |
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