Thermal Imaging in Biosystems Engineering: Principles and Applications - - Books - Springer Verlag, Singapore - 9789819231461 - September 21, 2026
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Thermal Imaging in Biosystems Engineering: Principles and Applications

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This book provides an overview of infrared thermal imaging as an advanced, non-contact, and non-destructive tool in biosystems engineering.

Media Books     Hardcover Book   (Book with hard spine and cover)
To be released September 21, 2026
ISBN13 9789819231461
Publishers Springer Verlag, Singapore
Pages 254
Dimensions 150 × 220 × 20 mm   ·   541 g   (Weight (estimated))
Editor Jayas, Digvir S.
Editor Kheiralipour, Kamran

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