3D Microelectronic Packaging: From Architectures to Applications - Springer Series in Advanced Microelectronics - - Books - Springer Verlag, Singapore - 9789811570926 - November 24, 2021
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3D Microelectronic Packaging: From Architectures to Applications - Springer Series in Advanced Microelectronics Second Edition 2021 edition

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This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

622 pages, 100 Tables, color; 205 Illustrations, color; 94 Illustrations, black and white; XVII, 622

Media Books     Paperback Book   (Book with soft cover and glued back)
Released November 24, 2021
ISBN13 9789811570926
Publishers Springer Verlag, Singapore
Pages 622
Dimensions 150 × 220 × 10 mm   ·   967 g
Editor Goyal, Deepak
Editor Li, Yan

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