Electrical Design of Through Silicon Via - - Books - Springer - 9789401779494 - September 27, 2016
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Electrical Design of Through Silicon Via Softcover reprint of the original 1st ed. 2014 edition

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This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity.

280 pages, 249 Tables, color; 249 Illustrations, black and white; IX, 280 p. 249 illus.

Media Books     Paperback Book   (Book with soft cover and glued back)
Released September 27, 2016
ISBN13 9789401779494
Publishers Springer
Pages 280
Dimensions 150 × 220 × 10 mm   ·   412 g
Editor Kim, Joungho
Editor Lee, Manho
Editor Pak, Jun So

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