Interfacial Energy for Oraganosilane Tailored Copper-silica Interface: Delamination Nanomechanics and Energy Partition into Adhesion and Plasticity - Ashutosh Jain - Books - LAP LAMBERT Academic Publishing - 9783843373906 - November 16, 2010
In case cover and title do not match, the title is correct

Interfacial Energy for Oraganosilane Tailored Copper-silica Interface: Delamination Nanomechanics and Energy Partition into Adhesion and Plasticity


Get an email once the item is available
Do you have a profile? Log in
Get notified about new Ashutosh Jain releases
Add to your iMusic wish list

Not rated yet

The partitioning of interface fracture energy into bond breaking energy and plastic energy in ductile layer(s) constituting the interface is a central problem in fracture mechanics. A new approach to partition the fracture energy of a metal-ceramic interface into work of adhesion and plasticity is introduced, unveiling the nanomechanics of interfacial deformation and fracture. The crack path uncertainties are obviated by constraining fracture to occur in an interfacial molecular layer through fissure of a single bond type whose strength is varied by adjusting the chemical environment. This approach is adaptable for studying interfacial fracture and related phenomena in diverse materials systems in different thermochemical environments.

Media Books     Paperback Book   (Book with soft cover and glued back)
Released November 16, 2010
ISBN13 9783843373906
Publishers LAP LAMBERT Academic Publishing
Pages 124
Dimensions 226 × 7 × 150 mm   ·   203 g
Language German