Flip Chip Bonding mit Umstellung auf bleifreie Lotmaterialien: Fachubergreifende Studienarbeit - Jens Markusch - Books - Grin Verlag - 9783640821822 - February 16, 2011
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Jens Markusch
Flip Chip Bonding mit Umstellung auf bleifreie Lotmaterialien: Fachubergreifende Studienarbeit German edition

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72 pages

Media Books     Paperback Book   (Book with soft cover and glued back)
Released February 16, 2011
ISBN13 9783640821822
Publishers Grin Verlag
Pages 72
Dimensions 148 × 210 × 4 mm   ·   118 g
Language German  

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