Handbook of Wafer Bonding - P Ramm - Books - Wiley-VCH Verlag GmbH - 9783527326464 - January 11, 2012
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P Ramm
Handbook of Wafer Bonding

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Filling a gap for a handbook and reference on recent developments in wafer bonding technology, an author and editor team from microsystems companies and industry-near research organizations presents reliable, first-hand information.

425 pages, Illustrations

Media Books     Hardcover Book   (Book with hard spine and cover)
Released January 11, 2012
ISBN13 9783527326464
Publishers Wiley-VCH Verlag GmbH
Pages 425
Dimensions 177 × 246 × 24 mm   ·   932 g
Language English  
Editor Lu, James Jian-Qiang (Rensellaer Polytechnic Institute, Troy, NY, USA)
Editor Ramm, Peter (Fraunhofer Institut Munchen, Ge)
Editor Taklo, Maaike M. V. (SINTEF ICT, Oslo, Norway)

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