Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications - - Books - Springer International Publishing AG - 9783319792552 - March 28, 2019
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Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications Softcover reprint of the original 1st ed. 2015 edition

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This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.

408 pages, 35 Tables, black and white; 269 Illustrations, color; 191 Illustrations, black and white;

Media Books     Paperback Book   (Book with soft cover and glued back)
Released March 28, 2019
ISBN13 9783319792552
Publishers Springer International Publishing AG
Pages 408
Dimensions 150 × 220 × 10 mm   ·   645 g
Language German  
Editor Kada, Morihiro
Editor Kondo, Kazuo
Editor Takahashi, Kenji

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