RF and Microwave Microelectronics Packaging II - - Books - Springer International Publishing AG - 9783319516967 - March 22, 2017
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RF and Microwave Microelectronics Packaging II 1st ed. 2017 edition

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It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.

172 pages, 50 black & white illustrations, 77 colour illustrations, 130 colour tables, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released March 22, 2017
ISBN13 9783319516967
Publishers Springer International Publishing AG
Pages 172
Dimensions 155 × 235 × 13 mm   ·   439 g
Language French  
Editor Kuang, Ken
Editor Sturdivant, Rick

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