3D Stacked Chips: From Emerging Processes to Heterogeneous Systems - - Books - Springer International Publishing AG - 9783319204802 - May 23, 2016
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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems 1st ed. 2016 edition

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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.

339 pages, 81 black & white illustrations, 157 colour illustrations, 22 black & white tables, 193 co

Media Books     Hardcover Book   (Book with hard spine and cover)
Released May 23, 2016
ISBN13 9783319204802
Publishers Springer International Publishing AG
Pages 339
Dimensions 241 × 166 × 26 mm   ·   684 g
Language German  
Editor Elfadel, Ibrahim (Abe) M.
Editor Fettweis, Gerhard

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