Semiconductor Power Devices: Volume 2: Packaging, Thermal aspects, Reliability and Ruggedness - Josef Lutz - Books - Springer Nature Switzerland AG - 9783032234889 - August 13, 2026
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Semiconductor Power Devices: Volume 2: Packaging, Thermal aspects, Reliability and Ruggedness Third Edition 2026 edition

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HK$ 1,596
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Expected delivery Aug 21 - 26
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This new edition of the book Semiconductor Power Devices is now divided into two volumes. Additional chapters discuss electromagnetic disturbances, oscillations, and the integration of power electronic systems, making this volume an essential resource for engineers and researchers working on robust and efficient power device design.

Media Books     Hardcover Book   (Book with hard spine and cover)
To be released August 13, 2026
ISBN13 9783032234889
Publishers Springer Nature Switzerland AG
Pages 361
Dimensions 150 × 220 × 20 mm   ·   574 g   (Weight (estimated))

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