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Electronic Materials Innovations and Reliability in Advanced Memory Packaging - Springer Series in Reliability Engineering Chong Leong Gan
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Electronic Materials Innovations and Reliability in Advanced Memory Packaging - Springer Series in Reliability Engineering
Chong Leong Gan
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | July 22, 2025 |
| ISBN13 | 9783031947940 |
| Publishers | Springer International Publishing AG |
| Pages | 178 |
| Dimensions | 150 × 220 × 20 mm · 444 g |
| Language | German |
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