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CMOS Plasma and Process Damage Kirk Prall
CMOS Plasma and Process Damage
Kirk Prall
Readers will learn how plasma and process damage results from the high-energy processes that are used in chip manufacturing, causing harm to the chips, functional failure and reliability problems.
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | May 17, 2025 |
| ISBN13 | 9783031890284 |
| Publishers | Springer International Publishing AG |
| Pages | 466 |
| Dimensions | 150 × 220 × 20 mm · 891 g |
| Language | German |