Interconnect Reliability in Advanced Memory Device Packaging - Springer Series in Reliability Engineering - Gan, Chong Leong, - Books - Springer International Publishing AG - 9783031267109 - April 30, 2024
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Gan, Chong Leong,
Interconnect Reliability in Advanced Memory Device Packaging - Springer Series in Reliability Engineering 2023 edition

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This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously.

210 pages, 89 Illustrations, color; 11 Illustrations, black and white; XVIII, 210 p. 100 illus., 89

Media Books     Paperback Book   (Book with soft cover and glued back)
Released April 30, 2024
ISBN13 9783031267109
Publishers Springer International Publishing AG
Pages 210
Dimensions 150 × 220 × 10 mm   ·   394 g
Language German  

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