Tell your friends about this item:
More-than-Moore Devices and Integration for Semiconductors 2023 edition
More-than-Moore Devices and Integration for Semiconductors
This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources.
260 pages, XIV, 260 p.
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | February 18, 2023 |
| ISBN13 | 9783031216091 |
| Publishers | Springer International Publishing AG |
| Pages | 260 |
| Dimensions | 150 × 220 × 20 mm · 582 g |
| Language | German |
| Editor | Balestra, Francis |
| Editor | Iacopi, Francesca |