3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization - Lennart Bamberg - Books - Springer Nature Switzerland AG - 9783030982287 - June 28, 2022
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Lennart Bamberg
3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization 2022 edition

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This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.

395 pages, 100 Illustrations, color; 2 Illustrations, black and white; XXV, 395 p. 102 illus., 100 i

Media Books     Hardcover Book   (Book with hard spine and cover)
Released June 28, 2022
ISBN13 9783030982287
Publishers Springer Nature Switzerland AG
Pages 395
Dimensions 150 × 220 × 20 mm   ·   766 g
Language German  

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