Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes - E Zschech - Books - Springer London Ltd - 9781852339418 - September 1, 2005
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E Zschech
Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes 2005 edition

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This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.

508 pages, 72 black & white tables, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released September 1, 2005
ISBN13 9781852339418
Publishers Springer London Ltd
Pages 508
Dimensions 155 × 235 × 28 mm   ·   916 g
Language English  
Editor Mikolajick, Thomas
Editor Whelan, Caroline
Editor Zschech, Ehrenfried

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