Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging - Materials, Circuits and Devices - Zhang, Shuye (Associate Professor, Harbin Institute of Technology, China) - Books - Institution of Engineering and Technolog - 9781837241408 - July 1, 2025
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Zhang, Shuye (Associate Professor, Harbin Institute of Technology, China)
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging - Materials, Circuits and Devices

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There is a growing demand for more accurate simulation techniques to address the thermomechanical challenges faced in advanced electronic packaging. This book compiles the latest advancements in thermomechanical simulation methodologies, empowering readers with the knowledge to help optimize electronic package designs.

Media Books     Hardcover Book   (Book with hard spine and cover)
Released July 1, 2025
ISBN13 9781837241408
Publishers Institution of Engineering and Technolog
Pages 199
Dimensions 150 × 220 × 20 mm   ·   462 g

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