Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications - Shichun Qu - Books - Springer-Verlag New York Inc. - 9781493954384 - August 23, 2016
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Shichun Qu
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications Softcover reprint of the original 1st ed. 2015 edition

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Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.

339 pages, 58 black & white illustrations, 256 colour illustrations, 58 black & white tables, biogra

Media Books     Paperback Book   (Book with soft cover and glued back)
Released August 23, 2016
ISBN13 9781493954384
Publishers Springer-Verlag New York Inc.
Pages 322
Dimensions 234 × 156 × 17 mm   ·   462 g
Language English  

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