Copper Electrodeposition for Nanofabrication of Electronics Devices - Nanostructure Science and Technology - - Books - Springer-Verlag New York Inc. - 9781493953738 - August 23, 2016
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Copper Electrodeposition for Nanofabrication of Electronics Devices - Nanostructure Science and Technology Softcover reprint of the original 1st ed. 2014 edition

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In addition, the book will also cover important topics such as: * ULSI wiring material based upon copper nanowiring * Printed circuit boards * Stacked semiconductors * Through Silicon Via * Smooth copper foil for Lithium-Ion battery electrodes.

290 pages, 115 black & white illustrations, 75 colour illustrations, 12 black & white tables, biogra

Media Books     Paperback Book   (Book with soft cover and glued back)
Released August 23, 2016
ISBN13 9781493953738
Publishers Springer-Verlag New York Inc.
Pages 282
Dimensions 155 × 235 × 15 mm   ·   412 g
Language English  
Editor Akolkar, Rohan N.
Editor Barkey, Dale P.
Editor Kondo, Kazuo
Editor Yokoi, Masayuki

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