Integrated Circuit Packaging, Assembly and Interconnections - William Greig - Books - Springer-Verlag New York Inc. - 9781441939234 - October 29, 2010
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William Greig
Integrated Circuit Packaging, Assembly and Interconnections Softcover reprint of hardcover 1st ed. 2007 edition

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Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing.

300 pages, 75 black & white illustrations, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released October 29, 2010
ISBN13 9781441939234
Publishers Springer-Verlag New York Inc.
Pages 300
Dimensions 155 × 235 × 17 mm   ·   458 g
Language English  

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