King-Ning Tu
Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science King-Ning Tu Softcover reprint of hardcover 1st ed. 2007 edition

Name: Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science
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Author: King-Ning Tu

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Hardcover Book

2007 edition

(2007) HK$ 2,099

Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science

King-Ning Tu

Softcover reprint of hardcover 1st ed. 2007 edition

The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders.

370 pages, biography

Media	Books Paperback Book (Book with soft cover and glued back)
Released	November 19, 2010
ISBN13	9781441922847
Publishers	Springer-Verlag New York Inc.
Pages	370
Dimensions	155 × 235 × 20 mm · 539 g
Language	English