RF and Microwave Microelectronics Packaging - Ken Kuang - Books - Springer-Verlag New York Inc. - 9781441909831 - November 17, 2009
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Ken Kuang
RF and Microwave Microelectronics Packaging 2010 edition

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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector.

285 pages, 15 black & white tables, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released November 17, 2009
ISBN13 9781441909831
Publishers Springer-Verlag New York Inc.
Pages 285
Dimensions 165 × 242 × 23 mm   ·   603 g
Editor Cahill, Sean S.
Editor Kim, Franklin
Editor Kuang, Ken

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