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Stochastic Finite Element Modeling in Electronic Packaging Chu, Liu (Tongji University, China)
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Stochastic Finite Element Modeling in Electronic Packaging
Chu, Liu (Tongji University, China)
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | January 12, 2026 |
| ISBN13 | 9781394352944 |
| Publishers | John Wiley & Sons Inc |
| Pages | 288 |
| Dimensions | 238 × 158 × 22 mm · 532 g |
| Language | English |
