Materials for Advanced Semiconductor Packaging and Heterogeneous Integration - - Books - Taylor & Francis Ltd - 9781032959436 - October 20, 2026
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Materials for Advanced Semiconductor Packaging and Heterogeneous Integration

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HK$ 1,295
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Expected delivery Oct 28, 2026 - Nov 2, 2026

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This book offers a comprehensive review of the key topics and the latest advancements in innovative materials for advanced semiconductor packaging and heterogeneous integration.

Media Books     Hardcover Book   (Book with hard spine and cover)
To be released October 20, 2026
ISBN13 9781032959436
Publishers Taylor & Francis Ltd
Pages 560
Dimensions 150 × 220 × 20 mm   ·   453 g
Editor Shangguan, Dongkai

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