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Direct Copper Interconnection for Advanced Semiconductor Technology
Direct Copper Interconnection for Advanced Semiconductor Technology
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
| Media | Books Paperback Book (Book with soft cover and glued back) |
| To be released | May 22, 2026 |
| ISBN13 | 9781032528403 |
| Publishers | Taylor & Francis Ltd |
| Pages | 448 |
| Dimensions | 150 × 220 × 10 mm · 850 g |
| Editor | Shangguan, Dongkai |