Direct Copper Interconnection for Advanced Semiconductor Technology -  - Books - Taylor & Francis Ltd - 9781032528403 - May 22, 2026
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Direct Copper Interconnection for Advanced Semiconductor Technology

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HK$ 845
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Expected delivery Jun 1 - 4
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In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.

Media Books     Paperback Book   (Book with soft cover and glued back)
To be released May 22, 2026
ISBN13 9781032528403
Publishers Taylor & Francis Ltd
Pages 448
Dimensions 150 × 220 × 10 mm   ·   850 g
Editor Shangguan, Dongkai