Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Electronic Packaging and Interconnects - Dean L. Monthei - Books - Springer - 9780792383642 - November 30, 1998
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Dean L. Monthei
Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Electronic Packaging and Interconnects 1999 edition

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Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.

234 pages, 62 black & white illustrations, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released November 30, 1998
ISBN13 9780792383642
Publishers Springer
Pages 234
Dimensions 155 × 235 × 15 mm   ·   530 g
Language English  

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