Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging - John W. Mccormick - Books - Springer - 9780792376767 - January 31, 2003
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John W. Mccormick
Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging 2003 edition

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Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).

347 pages, 266 black & white illustrations, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released January 31, 2003
ISBN13 9780792376767
Publishers Springer
Pages 347
Dimensions 155 × 235 × 22 mm   ·   743 g
Language English  
Editor Balde, John W.

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