Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC - Er-Ping Li - Books - John Wiley & Sons Inc - 9780470623466 - April 19, 2012
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Er-Ping Li
Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

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The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques.

384 pages, Illustrations

Media Books     Hardcover Book   (Book with hard spine and cover)
Released April 19, 2012
ISBN13 9780470623466
Publishers John Wiley & Sons Inc
Pages 384
Dimensions 156 × 241 × 18 mm   ·   774 g

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