Electronics Cooling: From the Chip to the Datacenter - Advances in Heat Transfer - - Books - Elsevier Science Publishing Co Inc - 9780443470844 - November 1, 2026
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Electronics Cooling: From the Chip to the Datacenter - Advances in Heat Transfer

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HK$ 1,663
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Expected delivery Nov 9 - 12, 2026

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Media Books     Hardcover Book   (Book with hard spine and cover)
To be released November 1, 2026
ISBN13 9780443470844
Publishers Elsevier Science Publishing Co Inc
Pages 300
Dimensions 150 × 220 × 20 mm   ·   450 g

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