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Electronics Cooling: From the Chip to the Datacenter - Advances in Heat Transfer
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Electronics Cooling: From the Chip to the Datacenter - Advances in Heat Transfer
| Media | Books Hardcover Book (Book with hard spine and cover) |
| To be released | November 1, 2026 |
| ISBN13 | 9780443470844 |
| Publishers | Elsevier Science Publishing Co Inc |
| Pages | 300 |
| Dimensions | 150 × 220 × 20 mm · 450 g |
