Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices - Suhir, Ephraim (Portland State University, Portland, USA) - Books - Taylor & Francis Ltd - 9780367635886 - October 4, 2024
In case cover and title do not match, the title is correct

Suhir, Ephraim (Portland State University, Portland, USA)
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Price
HK$ 763
excl. VAT

Ordered from remote warehouse

Expected to be ready for shipping Aug 26 - Sep 7
Get notified about new Suhir, Ephraim (Portland State University, Portland, USA) releases

Our customers say:

14-day return policy in accordance with European consumer protection law
Top ranking on Trustpilot
Add to your iMusic wish list

Not rated yet

Also available as:

The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

382 pages, 49 Tables, black and white; 75 Illustrations, black and white

Media Books     Paperback Book   (Book with soft cover and glued back)
Released October 4, 2024
ISBN13 9780367635886
Publishers Taylor & Francis Ltd
Pages 382
Dimensions 150 × 220 × 10 mm   ·   453 g
Language English  

More by Suhir, Ephraim (Portland State University, Portland, USA)

Show all

More from the same publisher

See all of Suhir, Ephraim (Portland State University, Portland, USA) ( e.g. Paperback Book and Hardcover Book )